常見例句雙語例句Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.集成電路倒裝芯片封裝中半導體芯片及載體之間形成可靠聯(lián)接所用焊料中的鉛。www.saf-emc.comLead in solders to complete a viable electrical conneXXXon between semiconductor die and carrier within integrated circuit Flip Chip packages.集成電路倒裝芯片封裝中半導體鑄模和載波器的焊料中的鉛；Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.集成電路倒裝芯片封裝中半導體鑄模和載波器的焊料中的鉛； 返回 semiconductor chip carrier