常見例句There is no industry control limits for Copper and Lead in SnAgCu solder pot. 目前行業(yè)中沒有用于SnAgCu焊料槽中銅和鉛的控制極限。A study in the reactions between SnAgCu lead-free solders and Au/Ni surface finish in BGA packages. 蕭麗娟;化學(xué)工程與材料工程研究所;國立中央大學(xué);碩士;2002-07-18free-lead solder powder of SnAgCu system SnAgCu系無鉛焊錫粉末Wetting Property of Surface Mount Componest for SnAgCu Solder Alloys SnAgCu系釬料合金對表面貼裝元件潤濕特性研究Research on the SnAgCu Lead Free Solder with Minute Amount Rare Earth Elements 添加微量稀土元素的SnAgCu無鉛釬料的研究Wettability of SnAgCu Lead-free Solder Containing Low Ag for Different Substrate with Water-soluble Flux 水洗釬劑下SnAgCu系釬料對不同基板的潤濕特性 返回 SnAgCu