bga

常見例句

• Fitting option BGA nozzle ensures excellent result and efficient.
  選購專用BGA風(fēng)咀,使拆焊效果更佳及操作更快捷。
• Desirable for high-performance Ball Grid Array (BGA) package.
  高性能球形焊點(diǎn)陣列封裝需要倒裝焊。
• This method meets the needs of the on-line test of BGA coplanarity.
  該測量方法可以滿足BGA(球腳陣列)封裝引腳尺寸的實時在線檢測的需要。
• BGA measurement is measured for inside solder point.
  BGA量測以最內(nèi)側(cè)焊點(diǎn)為量測依據(jù)。
• This procdure provides instruction for lead free BGA reballing process.
  該程序為無鉛。
• SMT maintain, BGA chip rework, the good solderability, the low smog.
  SMT維修、BGA芯片焊接與植球，活性強(qiáng)，低煙霧。
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