常見例句雙語例句To simulate the long gold wire and large bond pad, an equivalent method was presented in thermal analysis.為了用較小的規(guī)模模擬相對較長的金線和較大的焊盤，提出了一種溫度場分析的等效方法。Both a passivation layer (18) and a polyimide layer (22) separate the last interconnect layer (16) and the bond pad (28).鈍化層（18）和聚酰亞胺層（22）將最后的 互連層（16）和接合焊盤（28）隔開。ip.comA semiconductor device (10) has contact between the last interconnect layer (16) and the bond pad that includes a barrier metal (26) between the bond pad (28) and the last interconnect layer (16).一種半導(dǎo)體器件（10），具有在最后的互連層（16）和接合焊盤 之間的接觸，該接合焊盤包括接合焊盤（28）和最后的互連層（16） 之間的阻擋金屬（26）。ip.com 返回 bond pad