基本解釋膠粘劑；芯片鍵合用粘合劑英漢例句雙語例句The main bonding technology is direct bonding, anodic bonding, adhesive bonding and eutectic bonding.目前主要的鍵合技術(shù)包括直接鍵合、陽極鍵合、粘結(jié)劑鍵合和共晶鍵合。An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.IC芯片以倒裝焊接或金屬線焊接或粘貼連接安裝于金屬基片的有介質(zhì)涂層的表面。The invention relates to an aqueous neoprene adhesive agent and the preparation method, which belongs to the fields of the elastic bonding adhesive with porous material and the preparation.一種水性氯丁粘合劑及其制備方法，屬于彈性、多孔材料的粘接用膠及其 制備領(lǐng)域。ip.com權(quán)威例句Car makers treat aluminum to increase protection from corrosion in multiple ways, but the cheapest is an adhesive bonding process that uses zinc phosphate.FORBES: Magazine Articlebonding adhesive更多例句詞組短語短語bonding g adhesive 芯片鍵合用粘合劑;膠粘劑artificial bonding adhesive 合成樹脂膠asphalt bonding adhesive 膠粘劑EPDM Bonding Adhesive 化學(xué)品英文名稱White Bonding Adhesive 白膠漿bonding adhesive更多詞組專業(yè)釋義電子、通信與自動(dòng)控制技術(shù)芯片鍵合用粘合劑