bonding machine

基本解釋

The hot embossing and bonding machines have been used practically in microfluidic chip automatic fabrication, and the chips have satisfactory quality, precision, repetition and consistency.
塑料微流控芯片熱壓鍵合設(shè)備已經(jīng)投入自動(dòng)化生產(chǎn)，生產(chǎn)的芯片質(zhì)量、精度、重復(fù)性和一致性良好。
Mixing and dispensing machines for safe sealing, bonding and encapsulating AND customized two-component polyurethane casting resins and foam gaskets for sealing, bonding and high-tech potting.
用于安全粘合、結(jié)合和封裝的混合和涂布機(jī)械以及客戶定制的用于粘合、結(jié)合和高科技封裝的雙組分聚氨酯充填樹脂以及泡棉。
The development of laminating processes and the features of advanced hot-melt bonding technique are introduced in this paper. The characteristics of different laminating machines are also discussed.
介紹了層壓復(fù)合工藝的發(fā)展及熱熔黏合新技術(shù)的特點(diǎn)，闡述了各種熱熔黏合層壓設(shè)備的性能。

Contending that wire-bonding machines were available to the Soviet Union from non COCOM-controlled foreign sources, Commerce Secretary Robert Mosbacher decided -- despite vigorous objections from the Defense Department and a contrary finding from the U.S. intelligence community -- to utilize his authority under the Export Administration Act to decontrol this technology.
CENTERFORSECURITYPOLICY: Center For Security Policy
Japanese companies have a similar grip on, for example, bonding material for integrated circuit packages and the lithography machines (called steppers) to make LCD panels.
ECONOMIST: Japan's technology champions