chip bonding

基本解釋

In thermosonic chip bonding process, the impedance of PZT transducer is a very important parameter.
在熱超聲芯片鍵合過(guò)程中，PZT換能器阻抗是鍵合系統(tǒng)的一個(gè)重要的研究參數(shù)。
To be an advancing technology in capsulation, there is a well developing foreground for the thermosonic flip-chip bonding.
熱超聲倒裝鍵合作為前沿封裝技術(shù)具有良好的發(fā)展前景。
This paper introduces the forward trends of flip chip bonding, the essential kinds of bumps, fabrication technology and testing technology about qualities.
介紹了芯片倒裝焊的重要意義、發(fā)展趨勢(shì)、基本的焊球類型、制作方法及焊球質(zhì)量的檢測(cè)技術(shù)。

This circuitry will allow the microprocessor maker to replace the delicate bonding wires connecting the chip to the package with tiny balls of solder.
FORBES: It's all in the packaging