常見例句The advance in application technique of brominated epoxy resin in copperclad laminates semiconductor sealants and fireproofing agents were reviewed. 綜述了溴代環(huán)氧樹脂在銅箔層合板、半導(dǎo)體封裝材料和防火劑方面的應(yīng)用技術(shù)進(jìn)展。copperclad steel wire 銅包鋼線Flexible CopperClad Laminates 撓性印制電路板基材COPPERCLAD LAMINATE 覆銅板基板 返回 copperclad