基本解釋鋼模結(jié)合；小片接合；芯片焊接；模片鍵合英漢例句雙語例句Thermal mismatch induced by the die bonding structure greatly affects the reliability and performance of MEMS devices.芯片粘接工藝引起的器件-封裝熱失配會(huì)對(duì)MEMS器件的可靠性和性能產(chǎn)生顯著影響。The die bonding requires the temperature field of the oven to be even, but an existing curing oven can not suit the requirement.半導(dǎo)體封裝粘結(jié)工藝養(yǎng)護(hù)過程要求爐內(nèi)溫度均勻分布，現(xiàn)有養(yǎng)護(hù)爐不能滿足這一要求。The thermal resister of power LED is analyzed in this paper. Using the silver paste and epoxy resin as die bonding materials, two kinds of power LEDs are made.分析了功率型LED熱阻系統(tǒng)的構(gòu)成，對(duì)采用銀漿和環(huán)氧膠作為芯片鍵合材料的功率型LED熱阻進(jìn)行了對(duì)比研究。die bonding更多例句詞組短語短語die mount bonding 小片裝配接合die -bonding 小片接合;芯片焊接設(shè)備die bonding jig 管心焊接模Die Bonding Tools 固晶die and wire bonding 芯片;芯片導(dǎo)線焊接die bonding更多詞組專業(yè)釋義電子、通信與自動(dòng)控制技術(shù)芯片鍵合芯片焊接片結(jié)法機(jī)械工程粒接法片結(jié)法