基本解釋下墊板，沖模墊；芯片安裝面積英漢例句雙語(yǔ)例句From the results of numerical simulation, it should decrease the friction of die and sheet in practice as possible. The optimal pressure-pad-force is obtained through FEM analysis.從數(shù)值模擬結(jié)果分析中得知，在實(shí)際拉深過(guò)程中要盡量減小模具和板料的摩擦，通過(guò)有限元模擬分析方法得到最佳壓邊力數(shù)值。Accroding to the structure characteristics of the Santana brake pad, determined product stamping process and blank size, the die design method was introduced, and solved the bending spring back.根據(jù)桑塔納汽車剎車片卡子結(jié)構(gòu)特點(diǎn)，確定該產(chǎn)品的沖壓工藝和產(chǎn)品展開尺寸，介紹模具設(shè)計(jì)方案，解決產(chǎn)品彎曲回彈問(wèn)題。http://chazidian.comdie pad更多例句詞組短語(yǔ)短語(yǔ)die e pad 下墊板PITCH HOLE DIE PAD 球洞的墊;距孔墊depressed die pad 下凹晶片焊墊polyurethane pad blanking die 聚氨酯沖裁模die pad更多詞組專業(yè)釋義電子、通信與自動(dòng)控制技術(shù)芯片安裝面積機(jī)械工程下墊板