die-attach

基本解釋

Today, semiconductor products use high-lead containing solder for a die attach material in various devices.
今天，半導(dǎo)體產(chǎn)品使用高含鉛的各種設(shè)備，模具材料附著焊錫。
Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation.
等離子體400和660系列是低壓微波等離子體應(yīng)用于提高模具粘合，引線的焊接，特別是清洗高級(jí)的芯片封裝。
Specially set structure and attach fine-adjustment protection device, flexible adjustments height and force of cutting, can prolong service life of cutting die and cutting rubber board.
特有設(shè)定構(gòu)造，附微調(diào)保護(hù)裝置，靈活調(diào)設(shè)裁斷高度和裁斷力度，能延長(zhǎng)刀模和裁斷板的使用壽命。