encapsulant

基本解釋

This curable materials could be used in organic encapsulant.
此材料可以做為有機封裝材。
Buried Service Wire Splice A watertight splice filled with an encapsulant.
地下服務導線接頭一種填充了密封劑的不漏水的接頭。
DU901 is a one component, epoxy encapsulant designed for use as a repairable underfill resin for CSP or BGA.
簡介：道爾DU901是一種單組分環(huán)氧密封劑，用于CSP或BGA底部填充制程。
The thermal and mechanical properties of the modified epoxy encapsulant were introduced.
并對改性后封裝料的結構、熱性能和機械性能作了詳細介紹。
Kester proudly announces that it has been awarded a patent for its Reflow Encapsulant technology including material and method of use.
凱斯特驕傲地宣布,它已獲得回流密封劑技術(其中包括材料和使用方法)的專利。