基本解釋倒裝焊接英漢例句雙語(yǔ)例句To be an advancing technology in capsulation, there is a well developing foreground for the thermosonic flip-chip bonding.熱超聲倒裝鍵合作為前沿封裝技術(shù)具有良好的發(fā)展前景。With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.采用多普勒激光振動(dòng)測(cè)量系統(tǒng)，獲得了熱超聲倒裝鍵合過(guò)程中工具末端及芯片的振動(dòng)速度曲線。flip chip bonding更多例句詞組短語(yǔ)短語(yǔ)Direct flip -chip bonding 直接倒裝芯片接合Flip -chip-bonding equipment 倒裝焊設(shè)備ultrasonic flip -chip bonding 超聲倒裝焊thermosonic flip -chip bonding 熱超聲倒裝鍵合flip -chip-bonding technique 倒裝焊技術(shù)flip chip bonding更多詞組專業(yè)釋義電子、通信與自動(dòng)控制技術(shù)倒裝式接合（法）倒裝焊接（法）