flip-chip

常見(jiàn)例句

• Flip Chip technology is a typical application.
  倒裝芯片技術(shù)就是其中一個(gè)典型應(yīng)用。
• As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps.
  當(dāng)電流通過(guò)焊點(diǎn)時(shí)，會(huì)伴隨產(chǎn)生焦耳熱效應(yīng)和電遷移效應(yīng)。
• A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants.
  關(guān)于單遍高可靠性倒裝片回流密封劑領(lǐng)域研發(fā)工作成就的綜述。
• The current crowding effect and temperature distributions in flip chip solders are discussed.
  本研究亦討論在覆晶焊點(diǎn)中之電流聚集效應(yīng)及其溫度分布。
• Delamination at the underfill/chip interface in a flip chip on board (FCOB) assembly was investigated through MSC.
  采用通用有限元軟件MSC.
• Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
  完成某集成電路封裝（叩焊芯片）內(nèi)部實(shí)際的電氣連接的焊料中的鉛。
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