microelectronic packaging

基本解釋

• [電子、通信與自動(dòng)控制技術(shù)]微電子組裝微型電子掐封裝
• [計(jì)算機(jī)科學(xué)技術(shù)]微電子封裝微電子組裝

英漢例句

雙語例句

• It is noted that microelectronic packaging technology becomes one of the most important and challenging technologies in radar and all other electronic products.
  令人矚目的是微電子組裝技術(shù)正在成為現(xiàn)代雷達(dá)及其他電子設(shè)備中最重要的關(guān)鍵技術(shù)之一。
• With the development of microelectronic packaging technologies, anisotropic conductive adhesives(ACA)are widely used as one kind of the green materials in the electronic interconnection.
  隨著微電子封裝技術(shù)的發(fā)展，各向異性導(dǎo)電膠作為一種綠色的連接材料，廣泛應(yīng)用于電子產(chǎn)品中。
• The application of the finite element numerical simulation of stress-strain field distribution in the reliability study of the solder joints in microelectronic packaging has been reviewed.
  就應(yīng)力—應(yīng)變場有限元數(shù)值模擬在微電子組裝焊點(diǎn)可靠性研究中的應(yīng)用進(jìn)行了綜述。

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詞組短語

短語

• microelectronic packaging technology 微電子組裝技術(shù)

• microelectronic packaging更多詞組

專業(yè)釋義

電子、通信與自動(dòng)控制技術(shù)

• 微電子組裝
• 微型電子掐封裝

計(jì)算機(jī)科學(xué)技術(shù)

• 微電子封裝
• 微電子組裝