常見例句雙語例句Anodic bonding technology of semiconductor silicon and glass wafer is key technology of MEMS. As one of the key materials, there is a broad industrial applied future about anodic bonding glass.半導體硅與玻璃的靜電鍵合技術是微電子機械系統(tǒng)（MEMS）的關鍵技術，而作為關鍵材料之一的靜電鍵合玻璃有著廣闊的工業(yè)應用前景。Without any kind of glue, wafer bonding technology is able to integrate two polished semiconductor wafers and thus be used widely in fields like micro-electronics micro-mechanics and optoelectronics.晶圓鍵合可以使得經過拋光的半導體晶圓在不使用粘結劑的情況下結合在一起。 返回 semiconductor bonding wafer