常見(jiàn)例句雙語(yǔ)例句With the same temperature on package, solder ball and PCB board, thermal cycling simulation ignores the thermal gradients in the whole assembly.熱循環(huán)模擬是在封裝、焊球和PCB基板的任一節(jié)點(diǎn)上施加相同的溫度載荷，忽略了整個(gè)封裝體內(nèi)溫度梯度的存在。Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.介紹了激光重熔在面陣列封裝釬料凸點(diǎn)成形中的研究進(jìn)展，并且對(duì)PBGA共晶釬料球激光重熔進(jìn)行了工藝研究。Laser bumping is advantageous for its flexibility especially when used for individual solder ball rework and small or medium production of BGA packages, yet it hasn′t been vastly applied presently.激光植球的優(yōu)勢(shì)在于它的柔性，它適宜于中小批量BGA的生產(chǎn)與個(gè)別焊球的修復(fù)，不過(guò)目前還沒(méi)有投入大規(guī)模的應(yīng)用。 返回 solder ball