常見例句雙語例句During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure.在下一個回流工序，錫膏浸潤焊盤表面，形成一個固態(tài)錫膏凸起。With the trend toward miniaturization, solder bumps are getting smaller, and the electric current loading of each solder bump is getting higher.隨著電子產(chǎn)品之微小化，焊料凸塊的尺寸越來越小，而焊料凸塊的電流密度也隨之增大。Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.介紹了激光重熔在面陣列封裝釬料凸點(diǎn)成形中的研究進(jìn)展，并且對PBGA共晶釬料球激光重熔進(jìn)行了工藝研究。 返回 solder bump