solder paste technology

基本解釋

It is believed that JetPrinting will more be adopted in electronics assembly, and will also be a competitive solder-paste printing technology.
可以確信焊膏噴印將會(huì)被更多地應(yīng)用于電子組裝上，成為一種具有競(jìng)爭(zhēng)力的焊膏印刷技術(shù)。
The uniformity parameters of solder paste can be extracted by this system, which is competent for the quality control of surface mount technology(SMT) product line.
建構(gòu)了電路板錫膏的三維測(cè)量系統(tǒng)，實(shí)現(xiàn)了印刷錫膏均勻性參數(shù)的獲取，從而達(dá)到對(duì)表面貼裝質(zhì)量進(jìn)行監(jiān)控和評(píng)價(jià)的目的。