substrate diffusion

基本解釋

The bonding between the coating layer and substrate is good and the diffusion occurs in the interface between them.
涂層與基體結(jié)合良好，界面附近存在元素?cái)U(kuò)散現(xiàn)象；
However, cracks initialized in the diffusion layer between substrate and bond coat when TBCs were tested with low cycle fatigue at high temperature.
而在高溫低周疲勞條件下裂紋是在粘結(jié)層與高溫合金基體的擴(kuò)散層處。
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In process parameters, the RF power and pressure affect the number, energy and composition of the basic elements, the substrate temperature effect the surface diffusion and atomic bonding.
工藝參數(shù)中，射頻功率和壓強(qiáng)綜合影響了基元數(shù)量、能量以及成分，基片溫度主要影響表面擴(kuò)散、原子成鍵。