thermosonic

常見例句

• The dynamic optimum design of high-frequency ultrasonic transducer was studied to improve thermosonic packaging efficiency and reduce packaging temperature.
  為提高熱超聲封裝效率、降低封裝溫度,研究了高頻超聲換能器的動力學優(yōu)化設計。
• The thermosonic flip chip bonding has been realized under the pressure constrain pattern of flip chip. Fragment of pad,circle band and ridge have been observed on the bonding interface.
  采用壓力約束模式夾持倒裝芯片,實現(xiàn)了熱超聲倒裝鍵合,觀察到環(huán)狀的鍵合界面微觀形貌,脊狀撕裂棱以及表皮層碎片。
• Schwizer, J., et al., 1999, ”Thermosonic ball bonding: Friction model based on integrated microsensor measurements,” Electronics Manufacturing Technology Symposium, 24th IEEE / CPMT, pp.108-114.
  陳津佑，2000，電子構裝熱超音波焊線制程之介面能量理論模式的建立及其應用，國立中正大學機械工程研究所，碩士論文。
• Thermosonic Flip Chip Bongding for Power LED Chips
  功率型LED芯片的熱超聲倒裝技術
• Formation of circle band interface of thermosonic flip chip bonding
  熱超聲倒裝鍵合環(huán)狀界面的形成
• Present Development of Thermosonic Flip - chip Bonding Process
  芯片封裝互連新工藝熱超聲倒裝焊的發(fā)展現(xiàn)狀
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