基本解釋晶片鍵合英漢例句雙語例句Through the silicon bonding, we achieve a wafer-level vacuum package, and the wire-bonding PAD is made after the fabrication is complete.在完成整體結(jié)構(gòu)圓片級真空封裝的同時，通過引線腔結(jié)構(gòu)方便地實現(xiàn)了中間電極的引線。A silicon wafer bonding technology and its application to new dielectric isolation combined with conventional V-shaped grooves are described.本文介紹了將我們開發(fā)的硅片粘合技術(shù)與傳統(tǒng)V形槽隔離工藝相結(jié)合而研制成功的一種新的介質(zhì)隔離方法。Without any kind of glue, wafer bonding technology is able to integrate two polished semiconductor wafers and thus be used widely in fields like micro-electronics micro-mechanics and optoelectronics.晶圓鍵合可以使得經(jīng)過拋光的半導(dǎo)體晶圓在不使用粘結(jié)劑的情況下結(jié)合在一起。wafer bonding更多例句詞組短語短語si wafer direct bonding 硅片鍵合Wafer Copper Bonding Method 晶圓銅接合方式wafer -bonding 晶片鍵合wafer direct bonding w db 晶片直接鍵合low temperature wafer direct bonding 圓片低溫鍵合wafer bonding更多詞組專業(yè)釋義電子、通信與自動控制技術(shù)圓片鍵合鍵合方法計算機科學技術(shù)硅片鍵合晶圓鍵合圓片鍵合