基本解釋[電子、通信與自動(dòng)控制技術(shù)]切片鋸英漢例句雙語例句The key technologies of Auto dicing saw, such as air spindle, transfer and orientation of wafer, automatic alignment and automatic wash are analyzed.從全自動(dòng)劃片機(jī)的工作機(jī)理出發(fā)，分析空氣靜壓電主軸、晶圓傳輸定位、自動(dòng)對(duì)準(zhǔn)、自動(dòng)清洗等全自動(dòng)劃片機(jī)的關(guān)鍵技術(shù)；wafer dicing saw更多例句詞組短語短語wafer r dicing saw 切片鋸dicing saw wafer scriber 劃片機(jī)wafer dicing saw更多詞組專業(yè)釋義電子、通信與自動(dòng)控制技術(shù)切片鋸