wirebond

基本解釋

• n.絲焊

同根派生

• wirebond相關(guān)詞

英漢例句

• Better manufacturing yield than wirebond for high pin-count chips.
  對(duì)于高密度引腳芯片，成品率優(yōu)于絲鍵合。
• Faster manufacturing through-put than wirebond for high pin-count chips.
  對(duì)于高密度引腳芯片，生產(chǎn)效率高于絲鍵合。
• In this paper, the main purpose of the analysis is to evaluates the effect of wirebond configuration and die geometry under plane and lateral force.
  摘要本文利用有限元素法及梁的撓度理論探討金線在兩種不同的受力情形下，三種不同金線幾何形狀和晶片位置。

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