bga

基本解釋

• (ball grid array, 球狀矩陣排列)

同根派生

• bga相關(guān)詞

英漢例句

• Fitting option BGA nozzle ensures excellent result and efficient.
  選購(gòu)專用BGA風(fēng)咀,使拆銲傚果更佳及操作更快捷。
• Desirable for high-performance Ball Grid Array (BGA) package.
  高性能球形銲點(diǎn)陣列封裝需要倒裝銲。
• This method meets the needs of the on-line test of BGA coplanarity.
  該測(cè)量方法可以滿足BGA(球腳陣列)封裝引腳尺寸的實(shí)時(shí)在線檢測(cè)的需要。
• BGA measurement is measured for inside solder point.
  BGA量測(cè)以最內(nèi)側(cè)銲點(diǎn)爲(wèi)量測(cè)依據(jù)。
• This procdure provides instruction for lead free BGA reballing process.
  該程序爲(wèi)無(wú)鉛。

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