flipchip

基本解釋

• n.倒裝
• adj.倒裝

同根派生

• flipchip相關(guān)詞

英漢例句

• The Flipchip bonded wafer is expected to increase from 3.4 million (2000) to 26.2 million (2005) wafers.
  倒裝銲晶片預(yù)計(jì)由三百四十萬(wàn)片(2000年)增長(zhǎng)至二千六百二十萬(wàn)片(2005年)。
• Pb is exempted if its composition is >85%. As for the flipchip bump, how do we measure this composition?
  問(wèn):成分大於85%25的鉛不在指令範(fàn)圍內(nèi)．如果是倒裝銲,我們應(yīng)該怎樣測(cè)量它的成分？
• The Flipchip bonded wafer market is predicted to grow 37% annually while the overall IC units will only grow 8%.
  倒裝銲晶片市場(chǎng)預(yù)計(jì)年增長(zhǎng)37%25，而整躰IC增長(zhǎng)僅8%25。
• flipchip transistor
  倒裝片晶躰琯

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