基本解釋[土木建築工程]環(huán)形頂蓬英漢例句雙語例句The memory element is positioned between and in electrical contact with the top electrode and the ring-shaped upper end of the second part of the bottom electrode.存儲組件位於頂電極的電性接觸與底電極第一上方的環(huán)形 頂終耑之間。ip.comring-shaped top更多例句專業(yè)釋義土木建築工程環(huán)形頂蓬