基本解釋[機(jī)械工程]銲接封裝英漢例句雙語例句The study introduced the subminiature and pint-size encapsulation CPLD, which was welded to the tailor-made seat of DIP encapsulation. , and formed the integrated circuit that pending programmed.該研究採用超小型或小型封裝的可編程器件CPLD，銲接到特制的DIP封裝的托座上，形成待編程的集成電路。welded encapsulation更多例句專業(yè)釋義機(jī)械工程銲接封裝