基本解釋[計算機科學技術]倒裝式芯片技術英漢例句雙語例句Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.基 板上的倒裝芯片一般采用底部填充技術以提高其封裝的可靠性。And the important role of advanced packagings such as CSP, BGA and Flip-chip technology in the microelectronics is described as well.論述了如CSP、BGA 及倒裝芯片等先進封裝技術在微電子工業(yè)中所發(fā)揮的重要作用。The key tech-nologies of Flip chip technology are that redistribution technology, under bump metallurgy(UBM), bump technology, reflow technology and underfill technology.倒裝技術是發(fā)展的關鍵技術，它包括再分布技術、凸點底層金屬（UBM）技術、凸點制備技術、倒扣焊接技術和底部填充技術等。flip-chip technology更多例句詞組短語短語Flip -Chip Bonding Technology 覆晶組裝技術FCT -Flip Chip Technology 技術flip-chip technology更多詞組專業(yè)釋義計算機科學技術倒裝式芯片技術