基本解釋[計(jì)算機(jī)科學(xué)技術(shù)]倒裝式芯片技術(shù)英漢例句雙語例句Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.基 板上的倒裝芯片一般採(cǎi)用底部填充技術(shù)以提高其封裝的可靠性。And the important role of advanced packagings such as CSP, BGA and Flip-chip technology in the microelectronics is described as well.論述了如CSP、BGA 及倒裝芯片等先進(jìn)封裝技術(shù)在微電子工業(yè)中所發(fā)揮的重要作用。The key tech-nologies of Flip chip technology are that redistribution technology, under bump metallurgy(UBM), bump technology, reflow technology and underfill technology.倒裝技術(shù)是發(fā)展的關(guān)鍵技術(shù),它包括再分佈技術(shù)、凸點(diǎn)底層金屬(UBM)技術(shù)、凸點(diǎn)制備技術(shù)、倒釦銲接技術(shù)和底部填充技術(shù)等。flip-chip technology更多例句詞組短語短語Flip -Chip Bonding Technology 覆晶組裝技術(shù)FCT -Flip Chip Technology 技術(shù)flip-chip technology更多詞組專業(yè)釋義計(jì)算機(jī)科學(xué)技術(shù)倒裝式芯片技術(shù)