基本解釋[電子、通信與自動控制技術(shù)]半導(dǎo)體芯片座英漢例句雙語例句Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.集成電路倒裝芯片封裝中半導(dǎo)體芯片及載體之間形成可靠聯(lián)接所用焊料中的鉛。www.saf-emc.comLead in solders to complete a viable electrical conneXXXon between semiconductor die and carrier within integrated circuit Flip Chip packages.集成電路倒裝芯片封裝中半導(dǎo)體鑄模和載波器的焊料中的鉛；Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.集成電路倒裝芯片封裝中半導(dǎo)體鑄模和載波器的焊料中的鉛；semiconductor chip carrier更多例句專業(yè)釋義電子、通信與自動控制技術(shù)半導(dǎo)體芯片座