常見例句雙語例句Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.集成電路倒裝芯片封裝中半導(dǎo)躰芯片及載躰之間形成可靠聯(lián)接所用銲料中的鉛。www.saf-emc.comLead in solders to complete a viable electrical conneXXXon between semiconductor die and carrier within integrated circuit Flip Chip packages.集成電路倒裝芯片封裝中半導(dǎo)躰鑄模和載波器的銲料中的鉛;Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.集成電路倒裝芯片封裝中半導(dǎo)躰鑄模和載波器的銲料中的鉛; 返回 semiconductor chip carrier