基本解釋[機(jī)械工程]熱氧化交聯(lián)英漢例句雙語例句During the integrated circuit packing process, the quality and service life of integrated circuit are decided directly by the quality of conductive adhesive through non-oxidation thermal curing.在集成電路封裝工藝過程中，對導(dǎo)電膠進(jìn)行無氧化加熱固化的質(zhì)量直接決定了集成電路的質(zhì)量和使用壽命。thermal-oxidation curing更多例句專業(yè)釋義機(jī)械工程熱氧化交聯(lián)