常見(jiàn)例句雙語(yǔ)例句During the integrated circuit packing process, the quality and service life of integrated circuit are decided directly by the quality of conductive adhesive through non-oxidation thermal curing.在集成電路封裝工藝過(guò)程中，對(duì)導(dǎo)電膠進(jìn)行無(wú)氧化加熱固化的質(zhì)量直接決定了集成電路的質(zhì)量和使用壽命。 返回 thermal-oxidation curing