underfill

基本解釋

• n.不滿

同根派生

• underfill相關(guān)詞

英漢例句

• DU901 is a one component, epoxy encapsulant designed for use as a repairable underfill resin for CSP or BGA.
  簡介：道爾DU901是一種單組分環(huán)氧密封劑，用於CSP或BGA底部填充制程。
• T hen show that correct underfill can dramatically increase thermal reliability.
  通過正確的底部填充，可提高倒裝芯片組裝的成品 率和可靠性。
• This makes complete sense, and it is followed by a picture of a modern chip with the bumps and underfill pointed out.
  這使得完整意義上說，這是其次的圖片現(xiàn)代芯片的顛簸和底層指出。
• The results show that the residual moisture within underfill materials enhances the stress level in solder joint.
  結(jié)果表明：在溼熱環(huán)境下，底充膠材料內(nèi)部殘畱的溼氣提高了銲點的應(yīng)力水平。
• A cure-dependent viscoelastic model was applied to describe the mechanical behavior of underfill.
  利用有限元倣真的方法，模擬了無鉛倒裝封裝器件封裝的工藝及可靠性測試。

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