underfill

常見例句

• DU901 is a one component, epoxy encapsulant designed for use as a repairable underfill resin for CSP or BGA.
  簡介：道爾DU901是一種單組分環(huán)氧密封劑，用於CSP或BGA底部填充制程。
• T hen show that correct underfill can dramatically increase thermal reliability.
  通過正確的底部填充，可提高倒裝芯片組裝的成品 率和可靠性。
• This makes complete sense, and it is followed by a picture of a modern chip with the bumps and underfill pointed out.
  這使得完整意義上說，這是其次的圖片現(xiàn)代芯片的顛簸和底層指出。
• The results show that the residual moisture within underfill materials enhances the stress level in solder joint.
  結果表明：在溼熱環(huán)境下，底充膠材料內部殘畱的溼氣提高了銲點的應力水平。
• A cure-dependent viscoelastic model was applied to describe the mechanical behavior of underfill.
  利用有限元倣真的方法，模擬了無鉛倒裝封裝器件封裝的工藝及可靠性測試。
• Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.
  有機基板上的倒裝芯片一般採用底部填充技術以提高其封裝的可靠性。
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