短語詞組短語bonding agent [膠粘]粘合劑;將單層粘合形成多層板的膠劑;鍵合劑WIRE BONDING 打線結(jié)合;線接合bonding orbital [物化]成鍵軌道;鍵軌函數(shù);成鍵軌函數(shù)ball bonding [電子][機(jī)]球焊;球形焊接;球形接合;球形鍵合Metallic Bonding 金屬鍵bonding adhesive 芯片鍵合用粘合劑;膠粘劑bonding pair 成鍵電子對(duì);鍵對(duì);計(jì)算鍵對(duì)bonding bar 等電位連接帶;等電位聯(lián)結(jié)帶chip bonding 芯片焊接;芯片級(jí)焊接詞組短語bonding strength 結(jié)合強(qiáng)度；粘接強(qiáng)度；黏合強(qiáng)度hydrogen bonding 氫鍵；氫鍵結(jié)合bonding agent 粘合劑，結(jié)合劑；保稅授信機(jī)構(gòu)diffusion bonding 擴(kuò)散壓合；擴(kuò)散接合；擴(kuò)散粘結(jié)bonding process 粘結(jié)法chemical bonding 化學(xué)膠合；化學(xué)鍵結(jié)wire bonding 引線接合法bonding force 結(jié)合力；鍵合力，粘合力；耦合力adhesive bonding 粘合劑metallurgical bonding 冶金結(jié)合bonding layer 粘結(jié)層；粘合層covalent bonding 共價(jià)鍵；共價(jià)鍵結(jié)；共價(jià)結(jié)合bonding material 粘著劑；粘接材料bonding energy 結(jié)合能，鍵能metallic bonding 金屬鍵；金屬結(jié)合劑bonding point 焊接點(diǎn)ultrasonic bonding [冶]超聲焊接bonding electron 價(jià)電子bonding wire 焊線；接地線；等電位連接線die bonding 鋼模結(jié)合；小片接合；芯片焊接；模片鍵合 返回 bonding